Throughput: up to 15'000 parts per hour  

• High speed die sorting from electronic map file (SECS-GEM)
• Wafer frame input: 4 to 12" (metal or plastic)
• Standard cassette type (24 x 8" - 13 x 12")
• Applications:    Bumped Die 
                        Bare Die Power 
                        Leadless packages (from 1.0 x 0.5 to 12 x 12 mm)    
• Only available solution on the market to test and mark single dies